bq24257

bq24258

SLUSBG0B – FEBRUARY 2013 – REVISED JULY 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

IN

–1.3

20

V

SW

–0.7

12

V

Pin voltage range (with respect

to PGND)

PMID, BOOT

–0.3

20

V

CSIN, BAT, DPB, LDO, SCL, SDA, STAT, D+, D–, CE, ISET, ILIM, VDPM

–0.3

7

V

BOOT relative to SW

–0.3

5

V

IN

2

A

Output Current (Continuous)

CSIN, BAT

4

A

Output Sink Current

STAT

5

mA

Operating free-air temperature range

–40

85

°C

Junction temperature, TJ

–40

125

°C

Storage temperature, TSTG

–65

150

°C

Lead temperature (soldering, 10 s)

300

°C

2

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin.

RECOMMENDED OPERATING CONDITIONS

All voltages are with respect to PGND if not specified. Currents are positive into, negative out of the specified pin. Consult

Packaging Section of the data book for thermal limitations and considerations of packages.

MIN

MAX

UNITS

IN voltage range

4.35

IN operating voltage range (bq24258)

4.35

10.5

V

IN operating voltage range (bq24257)

4.35

6.5

Input current

2

A

Current in charge mode, BAT

2

A

Current in discharge mode, BAT

4

A

Charge current programming resistor range

75

Ω

Input current limit programming resistor range

105

Ω

0

125

ºC

(1)

The inherent switching noise voltage spikes should not exceed the absolute maximum rating on either the BOOT or SW pins. A tight

layout minimizes switching noise.

THERMAL INFORMATION

bq24257

bq24258

UNITS

YFF

RGE

Junction-to-ambient thermal resistance

76.5

32.9

Junction-to-case (top) thermal resistance

0.2

32.8

Junction-to-board thermal resistance

44

10.6

°C/W

Junction-to-top characterization parameter

1.6

0.3

Junction-to-board characterization parameter

43.4

10.7

Junction-to-case (bottom) thermal resistance

N/A

2.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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