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AK5703EN Datasheet(PDF) 74 Page - Asahi Kasei Microsystems |
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AK5703EN Datasheet(HTML) 74 Page - Asahi Kasei Microsystems |
74 / 76 page [AK5703] MS1537-E-00 2013/05 - 74 - PACKAGE 28pin QFN (Unit: mm) 2.6 ± 0.1 0.40 Ref 0.20 1 8 14 22 4.0 ± 0.1 B A 7 28 15 21 C0.35 0.75 ± 0.05 0.05MAX + 0.05 0.03 Exposed Pad C 0.07 M C A B 0.08 C Note: The exposed pad on the bottom surface of the package must be open or connected to the ground. ■Material & Lead finish Package molding compound: Epoxy Resin, Halogen (Br and Cl) free Lead frame material: Cu Alloy Lead frame surface treatment: Solder (Pb free) plate |
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