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IS46TR82560AL-15HBLA1 Datasheet(PDF) 1 Page - Integrated Silicon Solution, Inc |
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IS46TR82560AL-15HBLA1 Datasheet(HTML) 1 Page - Integrated Silicon Solution, Inc |
1 / 81 page IS43/46TR16128A, IS43/46TR16128AL, IS43/46TR82560A, IS43/46TR82560AL Integrated Silicon Solution, Inc. – www.issi.com – 1 Rev. B1 8/08/2013 256Mx8, 128Mx16 2Gb DDR3 SDRAM AUGUST 2013 FEATURES Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V High speed data transfer rates with system frequency up to 933 MHz 8 internal banks for concurrent operation 8n-Bit pre-fetch architecture Programmable CAS Latency Programmable Additive Latency: 0, CL-1,CL-2 Programmable CAS WRITE latency (CWL) based on tCK Programmable Burst Length: 4 and 8 Programmable Burst Sequence: Sequential or Interleave BL switch on the fly Auto Self Refresh(ASR) Self Refresh Temperature(SRT) Refresh Interval: 7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C 3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C Partial Array Self Refresh Asynchronous RESET pin TDQS (Termination Data Strobe) supported (x8 only) OCD (Off-Chip Driver Impedance Adjustment) Dynamic ODT (On-Die Termination) Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω) Write Leveling Operating temperature: Commercial (TC = 0°C to +95°C) Industrial (TC = -40°C to +95°C) Automotive, A1 (TC = -40°C to +95°C) Automotive, A2 (TC = -40°C to +105°C) OPTIONS Configuration: 256Mx8 128Mx16 Package: 96-ball FBGA (9mm x 13mm) for x16 78-ball FBGA (8mm x 10.5mm) for x8 ADDRESS TABLE Parameter 256Mx8 128Mx16 Row Addressing A0-A14 A0-A13 Column Addressing A0-A9 A0-A9 Bank Addressing BA0-2 BA0-2 Page size 1KB 2KB Auto Precharge Addressing A10/AP A10/AP BL switch on the fly A12/BC# A12/BC# SPEED BIN Speed Option 187F 15H 125K 107M Units JEDEC Speed Grade DDR3-1066F DDR3-1333H DDR3-1600K DDR3-1866M CL-nRCD-nRP 7-7-7 9-9-9 11-11-11 13-13-13 tCK tRCD,tRP(min) 13.125 13.125 13.125 13.91 ns Note: Faster speed options are backward compatible to slower speed options. Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances |
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