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HSMS-280E Datasheet(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMS-280E Datasheet(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
5 / 10 page 5 Table 1. Typical SPICE Parameters Parameter Units HSMS-280x HSMS-281x HSMS-282x BV V75 25 15 CJ0 pF 1.6 1.1 0.7 EG eV 0.69 0.69 0.69 IBV A 1 E-5 1 E-5 1 E-4 IS A 3 E-8 4.8 E-9 2.2 E-8 N 1.08 1.08 1.08 RS Ω30 10 6 PB (VJ) V 0.65 0.65 0.65 PT (XTI) 2 2 2 M 0.5 0.5 0.5 Applications Information Introduction — Product Selection Avago’s family of Schottky products provides unique solutions to many design problems. The first step in choosing the right product is to select the diode type. All of the products in the HSMS-280x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-282x families. Each family has a dif- ferent set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1. A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (Rs). In applications which do not require high voltage the HSMS-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS-281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family. In general, the HSMS-282x family should be the designer’s first choice, with the -280x family reserved for high voltage applications and the HSMS-281x family for low flicker noise applications. Assembly Instructions SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT- 323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the perfor- mance. 0.026 0.039 0.079 0.022 Dimensions in inches 0.026 0.079 0.018 0.039 Dimensions in inches Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products. Assembly Instructions SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT- 363 (SC-70, 6 lead) package is shown in Figure 7 (dimen- sions are in inches). This layout provides ample allowance for package placement by automated assembly equip- ment without adding parasitics that could impair the performance. Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products. |
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