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HSDL-9100 Datasheet(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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HSDL-9100 Datasheet(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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10 / 13 page  10 Figure 11. Solder stencil aperture Figure 12. Keep-out area Adjacent Land Keep out and Solder Mask Areas Adjacent land keep out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2mm.It is recommended that two fiducial crosses be placed at mid length of the pads for unit alignment. Also do take note that there should not be any electrical routing with the component placement compartment. Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended Recommended Metal solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See Table 1 below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern. Table 1. Combinations of metal stencil aperture and metal stencil thickness Stencil thickness, t (mm) Aperture size (mm) Length, l Width, w 0.152 1.60+/-0.05 0.55+/-0.05 0.127 1.92 0.55+/-0.05 Dim. mm h 4.15 l11 k 5.5 j 3.5 Recommended land pattern Figure 10. Land Pattern Solder Pad, Mask and Metal Stencil Appendix A: HSDL-9100 SMT Assembly Application Note PCBA Land Pattern Solder Mask Metal stencil for solder paste printing Stencil Aperture l w t Apertures as per Land Dimensions Mounting Center j h Component placement Solder Mask k l Figure 9. Stencil and PCBA Solder / stencil opening for each pad is 2.4mm x0.6mm 7.7 7.1 2.4 2.1 |
Similar Part No. - HSDL-9100_09 |
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Similar Description - HSDL-9100_09 |
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