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HSDL-9100-024 Datasheet(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
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HSDL-9100-024 Datasheet(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 13 page 8 Baking Conditions Chart HSDL-9100 Moisture Proof Packaging All HSDL-9100 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp Time In reels 60 °C t 48hours In bulk 100 °C t 4hours 125 °C t 2 hours Baking should only be done once. Recommended Storage Conditions Storage Temperature 10°C to 30°C Relative Humidity below 60% RH Time from unsealing to soldering After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions. Figure 7. Baking conditions chart Environment less than 30 deg C, and less than 60% RH Yes No No Yes Perform Recommended Baking Conditions Package Is Opened (Unsealed) Units in A Sealed Moisture-Proof Package No Baking Is Necessary Package Is Opened less Than 168 hours |
Similar Part No. - HSDL-9100-024 |
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Similar Description - HSDL-9100-024 |
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