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BC847BPN3 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BC847BPN3 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 14 page BC847BPN_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 18 February 2009 3 of 14 NXP Semiconductors BC847BPN 45 V, 100 mA NPN/PNP general-purpose transistor 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. (1) FR4 PCB, mounting pad for collector 1 cm2 (2) FR4 PCB, standard footprint Fig 1. Per device: Power derating curves SOT363 (SC-88) Tamb (°C) −75 175 125 25 75 −25 006aab419 200 300 100 400 500 Ptot (mW) 0 (1) (2) Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 568 K/W [2] - - 500 K/W Rth(j-sp) thermal resistance from junction to solder point - - 230 K/W Per device Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 416 K/W [2] - - 313 K/W |
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