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TDA8950J-N1112 Datasheet(PDF) 8 Page - NXP Semiconductors |
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TDA8950J-N1112 Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 39 page  TDA8950_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 11 June 2009 8 of 39 NXP Semiconductors TDA8950 2 × 150 W class-D power amplifier 8.2 Pulse-width modulation frequency The amplifier output signal is a PWM signal with a typical carrier frequency of between 250 kHz and 450 kHz. A 2nd-order LC demodulation filter on the output is used to convert the PWM signal into an analog audio signal. The carrier frequency is determined by an external resistor, ROSC, connected between pins OSC and VSSA. The optimal carrier frequency setting is between 250 kHz and 450 kHz. The carrier frequency is set to 345 kHz by connecting an external 30 k Ω resistor between pins OSC and VSSA. See Table 9 for more details. If two or more Class D amplifiers are used in the same audio application, it is recommended that an external clock circuit be used with all devices (see Section 13.4). This will ensure that they operate at the same switching frequency, thus avoiding beat tones (if the switching frequencies are different, audible interference known as ‘beat tones’ can be generated) 8.3 Protection The following protection circuits are incorporated into the TDA8950: • Thermal protection: – Thermal FoldBack (TFB) – OverTemperature Protection (OTP) • OverCurrent Protection (OCP) • Window Protection (WP) • Supply voltage protection: – UnderVoltage Protection (UVP) – OverVoltage Protection (OVP) – UnBalance Protection (UBP) How the device reacts to a fault conditions depends on which protection circuit has been activated. 8.3.1 Thermal protection The TDA8950 employes an advanced thermal protection strategy. A TFB function gradually reduces the output power within a defined temperature range. If the temperature continues to rise, OTP is activated to shut down the device completely. 8.3.1.1 Thermal FoldBack (TFB) If the junction temperature (Tj) exceeds the thermal foldback activation threshold, the gain is gradually reduced. This reduces the output signal amplitude and the power dissipation, eventually stabilizing the temperature. TFB is specified at the thermal foldback activation temperature Tact(th_fold) where the closed-loop voltage gain is reduced by 6 dB. The TFB range is: Tact(th_fold) − 5 °C < Tact(th_fold) < Tact(th_prot) The value of Tact(th_fold) for the TDA8950 is approximately 153 °C; see Table 8 for more details. |
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