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ACPM-5011-BLK Datasheet(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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ACPM-5011-BLK Datasheet(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 13 page 11 Reflow Profile Recommendations Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C 25 Time Tp TL tp tL t 25° C to Peak Ramp-up ts Tsmin Ramp-down Preheat Critical Zone TL to Tp Tsmax Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C Profile Feature Sn-Pb Solder Pb-Free Solder Average ramp-up rate (TL to TP) 3° C/sec max 3° C/sec max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 100° C 150° C 60-120 sec 150° C 200° C 60-180 sec Tsmax to TL – Ramp-up Rate 3° C/sec max Time maintained above: – Temperature (TL) – Time (TL) 183° C 60-150 sec 217° C 60-150 sec Peak temperature (TP) 240 +0/-5° C 260 +0/-5° C Time within 5° C of actual Peak Temperature (TP) 10-30 sec 20-40 sec Ramp-down Rate 6° C/sec max 6° C/sec max Time 25° C to Peak Temperature 6 min max. 8 min max. |
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