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ACPM-5013-BLK Datasheet(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED

Part # ACPM-5013-BLK
Description  3 x 3 mm Power Amplifier Module LTE Band13/14 (777-798 MHz)
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Manufacturer  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Direct Link  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

ACPM-5013-BLK Datasheet(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED

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7
Metallization
Solder Mask Opening
Solder Paste Stencil Aperture
PCB Design Guidelines
The recommended PCB land pattern is shown in figures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across the
I/O pads or conductive paddle to adjacent I/O pads. Con-
sidering the fact that solder paste thickness will directly
affect the quality of the solder joint, a good choice is to
use laser cut stencil composed of 0.100 mm (4 mils) or
0.127 mm (5 mils) thick stainless steel which is capable of
producing the required fine stencil outline.
0.30
0.60
0.35
0.55
0.45
on 0.5mm pitch
Ø 0.3mm
0.475
connected to a inner layer
through a via hole for a
better isolation between
CPL_IN(ISO) and RFout
0.65
0.45
0.50
0.60
1.50
1.30
0.525
0.55
0.45
1.10
1.10
0.60
0.35
0.475


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