MPC8349CVVAGDB datasheet(54/87 Pages) FREESCALE

Part #	MPC8349CVVAGDB

Description	Integrated Host Processor Hardware Specifications

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13

54

Freescale Semiconductor

Package and Pin Listings

18.1

Package Parameters for the MPC8349EA TBGA

The package parameters are provided in the following list. The package type is 35 mm

× 35 mm, 672 tape

ball grid array (TBGA).

Package outline

35 mm

× 35 mm

Interconnects

672

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder balls

62 Sn/36 Pb/2 Ag (ZU package)

96.5 Sn/3.5Ag (VV package)

Ball diameter (typical)

0.64 mm

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