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C3216X5R1E226M Datasheet(PDF) 3 Page - TDK Electronics |
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C3216X5R1E226M Datasheet(HTML) 3 Page - TDK Electronics |
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3 / 64 page  2 C General Application • Wide range of case size and superior dimension precision • Available in EIA class 1 and 2 dielectrics up to 50V • 01005 ~ 2220 / C0G, SL, X5R, X6S, X7R, X7S, Y5V • 4V ~ 50V / up to 100 µF Mid Voltage • Unique design allows for higher voltage in smaller case size • Available in 100V, 250V, 450V, and 630V • 0402 ~ 2220 / C0G, X6S, X7R, X7S, X7T • 100V ~ 630V / up to 15 µF High Voltage • Advance design provides improved withstanding voltage • Available rating up to 3000V • 1808 ~ 1812 / C0G, X7R, X7S • 1000V ~ 3000V / up to 10 nF High Temperature • Stable temperature characteristics up to 150ºC • Highly precise temperature performance (±7.5%) up to 125º C • 0402 ~ 1210 / X8R • 16V ~ 100V / up to 10 µF High Q • Design with higher Q factor than standard capacitors • Excellent attenuation and high self resonance frequency (SRF) • 0201 / C0G • 25V / up to 20 pF Flip Type • Flipped geometry provides lower inductance than standard capacitor • Special design allows for adequate high frequency current to IC • 0204 ~ 0612 / X5R, X6S, X7R, X7S • 4V ~ 50V / up to 10 µF Open Mode • Unique design allows for increase resistance to mechanical bending • Improved performance in vibration and electrical stresses • 0805 ~ 2220 / X7R, X8R • 16V ~ 630V / up to 22 µF Soft Termination • Improved bending resistance and temperature cycle performance • Termination technology available for most case sizes including arrays • 0805 ~ 3025 / X7R, X7S, X7T • 16V ~ 630V / up to 100 µF Conductive Epoxy • AgPdCu termination for conductive glue mounting • Improved mechanical/thermal strength when used with conductive glue • 0402 ~ 1210 / C0G, X7R, X8R • 25V ~ 100V / up to 10 µF CER Controlled ESR • Unique design allows for specified “controlled” ESR • Same no-hassle mounting method as standard 2-terminal components • ESR is controlled without affecting the ESL • 0603 ~ 0805 / X5R • 4V ~ 10V / up to 10 µF CEU Serial Design • 2 series-connected capacitors in one body • Improved bending resistance and temperature cycle performance • Ultra high reliability design for automotive battery line applications • 0603 ~ 0805 / X7R • 50V / up to 100 nF CGA Automotive Application • Qualified to CDF AEC Q-200 automotive testing standard • Manufactured using matured process for guaranteed performance • Available in C0G, X7R and X8R temperature characteristics • 0402 ~ 2220 / C0G, X5R, X7R, X7S, X7T, X8R • 6.3V ~ 630V / up to 47 µF CGJ Extended Life • Extensive testing to ensure higher reliability and longer life • Reliability tests based on MIL-STD requirements • Guaranteed TC Bias and Hot IR performance • 0402 ~ 1206 / C0G, X7R • 6.3V ~ 50V / up to 10 µF CKC 2-in-1 Array 4-in-1 Array • Allows for reduction of PCB space and mounting time • Unique electrode design reduces crosstalk • Also available in soft termination for higher reliability performance • CKCN27 ~ CKCA43 / C0G, X5R, X7R • 6.3V ~ 50V / up to 2.2 µF CKD Feed Through • Optimized for noise bypass with signal and power source circuits • Can be used for meeting EMC requirements • Ideal for use at higher frequencies due to low parasitic inductance • 0402 ~ 1206 / up to 125ºC temperature range • 6.3V ~ 50V / up to 22 µF CKG Mega Cap • Advance design for twice the capacitance on single footprint • Improved vibration and thermal/mechanical stress performance • Lower ESR and ESL than ALU and TA capacitor • CKGxxK ~ CKGxxN / X5R, X7R, X7S, X7T • 16V ~ 630V / up to 100 µF CLL Ultra Low Inductance • Unique internal structure allows cancelation of magnetic fields to reduce equivalent series inductance • Eight sided terminal electrode design in one capacitor • 0603 ~ 0805 / X7R, X7S • 4V ~ 10V / up to 4.7 µF TDK MLCC PRODUCT LINE ©TDK Corporation of America – Contents are subject to change without notice. |
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