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AD7862AR-3 Datasheet(PDF) 3 Page - Analog Devices |
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AD7862AR-3 Datasheet(HTML) 3 Page - Analog Devices |
3 / 16 page –3– REV. 0 AD7862 AB S Parameter Version 1 Version Version Units Test Conditions/Comments LOGIC OUTPUTS Output High Voltage, VOH 4.0 4.0 4.0 V min ISOURCE = 200 µA Output Low Voltage, VOL 0.4 0.4 0.4 V max ISINK = 1.6 mA DB11–DB0 Floating-State Leakage Current ±10 ±10 ±10 µA max Floating-State Capacitance 4 10 10 10 pF max Output Coding AD7862-10, AD7862-3 Twos Complement AD7863-2 Straight (Natural) Binary CONVERSION RATE Conversion Time 3.6 3.6 3.6 µs max For Both Channels Track/Hold Acquisition Time 2, 3 0.3 0.3 0.3 µs max POWER REQUIREMENTS VDD +5 +5 +5 V nom ±5% for Specified Performance IDD Normal Mode 15 15 15 mA max Standby Mode 25 25 25 µA max Logic Inputs = 0 V or VDD Power Dissipation Normal Mode 75 75 75 mW max Typically 60 mW Standby Mode 125 125 125 µW max Typically 75 µW NOTES 1Temperature ranges are as follows: A, B Versions: –40 °C to +85°C; S Version: –55 °C to +125°C. 2 Performance measured through full channel (multiplexer, SHA and ADC). 3See Terminology. ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.3 V Analog Input Voltage to AGND AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±17 V AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7V AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (A, B Version) . . . . . . . . . . . –40 °C to +85°C Extended (S Version) . . . . . . . . . . . . . . . . –55 °C to +125°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116 °C/W Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 °C Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116 °C/W Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE Input Relative Temperature Package Package Model Input Accuracy Range Description Option AD7862AR-10 ±10 V ±1 LSB –40 °C to +85°C 28-Bit Small Outline Package R-28 AD7862BR-10 ±10 V ±1 LSB –40 °C to +85°C 28-Bit Small Outline Package R-28 AD7862ARS-10 ±10 V ±1 LSB –40 °C to +85°C 28-Bit Shrink Small Outline Package RS-28 AD7862AN-10 ±10 V ±1 LSB –40 °C to +85°C 28-Bit Plastic DIP N-28 AD7862SQ-10 ±10 V ±1 LSB –55 °C to +125°C 28-Bit Cerdip Q-28 AD7862AR-3 ±2.5 V ±1 LSB –40 °C to +85°C 28-Bit Small Outline Package R-28 AD7862BR-3 ±2.5 V ±1 LSB –40 °C to +85°C 28-Bit Small Outline Package R-28 AD7862ARS-3 ±2.5 V ±1 LSB –40 °C to +85°C 28-Bit Shrink Small Outline Package RS-28 AD7862AN-3 ±2.5 V ±1 LSB –40 °C to +85°C 28-Plastic DIP N-28 AD7862AR-2 0 V to 2.5 V ±1 LSB –40 °C to +85°C 28-Bit Small Outline Package R-28 AD7862ARS-2 0 V to 2.5 V ±1 LSB –40 °C to +85°C 28-Bit Shrink Small Outline Package RS-28 4Sample tested @ +25 °C to ensure compliance. Specifications subject to change without notice. |
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