NCP45520, NCP45521

http://onsemi.com

2

Table 1. PIN DESCRIPTION

Pin

Name

Function

1, 9

Drain of MOSFET (0.5 V – 13.5 V), Pin 1 must be connected to Pin 9

2

EN

NCP45520−H & NCP45521−H − Active−high digital input used to turn on the MOSFET, pin

has an internal pull down resistor to GND

NCP45520−L & NCP45521−L − Active−low digital input used to turn on the MOSFET, pin has

3

Supply voltage to controller (3.0 V − 5.5 V)

4

GND

Controller ground

5

BLEED

6

PG

NCP45520 − Active−high, open−drain output that indicates when the gate of the MOSFET is

fully charged, external pull up resistor ≥ 1 kW to an external voltage source required; tie to

GND if not used

SR

NCP45521 − Slew rate adjustment; float if not used

7, 8

Source of MOSFET connected to load

Table 2. ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Supply Voltage Range

−0.3 to 6

V

Input Voltage Range

−0.3 to 18

V

Output Voltage Range

−0.3 to 18

V

EN Digital Input Range

V

PG Output Voltage Range (Note 1)

−0.3 to 6

V

Thermal Resistance, Junction−to−Ambient, Steady State (Note 2)

40.0

°C/W

Thermal Resistance, Junction−to−Ambient, Steady State (Note 3)

72.7

°C/W

5.3

°C/W

10.5

A

7.8

A

2.50

24.9

W

mW/°C

1.37

13.8

W

mW/°C

Storage Temperature Range

−40 to 150

°C

Lead Temperature, Soldering (10 sec.)

260

°C

ESD Capability, Human Body Model (Notes 5 and 6)

3.0

kV

ESD Capability, Machine Model (Note 5)

200

V

ESD Capability, Charged Device Model (Note 5)

1.0

kV

Latch−up Current Immunity (Notes 5 and 6)

LU

100

mA

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. NCP45520 only. PG is an open−drain output that requires an external pull up resistor ≥ 1 kW to an external voltage source.

2. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.

3. Surface−mounted on FR4 board using the minimum recommended pad size, 1 oz Cu.

4. Ensure that the expected operating MOSFET current will not cause the Short−Circuit Protection to turn the MOSFET off undesirably.

ESD Human Body Model tested per JESD22−A114

ESD Machine Model tested per JESD22−A115

ESD Charged Device Model tested per JESD22−C101

Latch−up Current tested per JESD78