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UCC24610D Datasheet(PDF) 3 Page - Texas Instruments |
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UCC24610D Datasheet(HTML) 3 Page - Texas Instruments |
3 / 35 page UCC24610 www.ti.com SLUSA87B – AUGUST 2010 – REVISED SEPTEMBER 2010 THERMAL INFORMATION UCC24610 THERMAL METRIC(1) D DRB UNITS 8 PINS 8 PINS qJA Junction-to-ambient thermal resistance(2) 147 67 qJCtop Junction-to-case (top) thermal resistance(3) 89 84.6 °C/W qJB Junction-to-board thermal resistance(4) 82 20.3 qJCbot Junction-to-case (bottom) thermal resistance(5) 7.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. RECOMMENDED OPERATING CONDITIONS All voltages are with respect to GND; currents are positive into and negative out of the specified terminal. −40°C < TJ = TA < 125°C. (unless otherwise noted) PARAMETER MIN NOM MAX UNIT VIN VCC input voltage 4.5 5.5 V VCC bypass capacitor 0.1 - µF TJ Junction temperature -40 125 °C fS Switching frequency 20 600 kHz TON-to-GND resistor 10 261 k Ω EN/TOFF-to-GND resistor 93 280 SYNC pulse width at VTHSYNC-0.1V 20 - ns Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): UCC24610 |
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