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TMS320C6455BZTZ Datasheet(PDF) 52 Page - Texas Instruments |
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TMS320C6455BZTZ Datasheet(HTML) 52 Page - Texas Instruments |
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52 / 256 page  C64x+ DSP: C6455 PREFIX TMS 320 C6455 GTZ TMX = Experimental device TMS = Qualified device DEVICE FAMILY 320 = TMS320 DSP family PACKAGE TYPE (B) CTZ = 697-pin plastic BGA, with Pb-Free die bump and solder balls GTZ = 697-pin plastic BGA with Pb-ed solder balls ZTZ = 697-pin plastic BGA, with Pb-Free solder balls DEVICE DEVICE SPEED RANGE ( ) 7 = 720 MHz 8 = 850 MHz Blank = 1 GHz 2 = 1.2 GHz ( ) TEMPERATURE RANGE (A) Blank = 0°C to 90°C (default commercial temperature) A = -40°C to 105°C (extended temperature) 2 SILICON REVISION (C) B = silicon revision 2.1 D = silicon revision 3.1 TMS320C6455 SPRS276M – MAY 2005 – REVISED MARCH 2012 www.ti.com TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, GTZ), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz (for example, 2 is 1200 MHz [1.2 GHz]). Figure 2-13 provides a legend for reading the complete device name for any TMS320C64x+™ DSP generation member. For device part numbers and further ordering information for TMS320C6455 in the CTZ/GTZ/ZTZ package type, see the TI website (www.ti.com) or contact your TI sales representative. A. The extended temperature "A version" devices may have different operating conditions than the commercial temperature devices. For more details, see Section 6.2, Recommended Operating Conditions. B. BGA = Ball Grid Array C. For silicon revision information, see the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number SPRZ234). Figure 2-13. TMS320C64x+™ DSP Device Nomenclature (including the TMS320C6455 DSP) 2.8.2.2 Documentation Support The following documents describe the TMS320C6455 Fixed-Point Digital Signal Processor. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com. SPRU871 TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital signal processor (DSP) megamodule. Included is a discussion on the internal direct memory access (IDMA) controller, the interrupt controller, the power-down controller, memory protection, bandwidth management, and the memory and cache. SPRU732 TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+ digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an enhancement of the C64x DSP with added functionality and an expanded instruction set. SPRAA84 TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The objective of this document is to indicate differences between the two cores. Functionality in the devices that is identical is not included. SPRU889 High-Speed DSP Systems Design Reference Guide. Provides recommendations for meeting the many challenges of high-speed DSP system design. These recommendations include information about DSP audio, video, and communications systems for the C5000 and C6000 DSP platforms. SPRU965 TMS320C6455 Technical Reference. An introduction to the TMS320C6455 DSP and discusses the application areas that are enhanced. 52 Device Overview Copyright © 2005–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320C6455 |
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