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AD8014ARTZ-REEL Datasheet(PDF) 4 Page - Analog Devices |
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AD8014ARTZ-REEL Datasheet(HTML) 4 Page - Analog Devices |
4 / 11 page AD8014 –4– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8014 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V Internal Power Dissipation2 Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . 0.75 W SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . 0.5 W Input Voltage Common Mode . . . . . . . . . . . . . . . . . . . . . . ±V S Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . ±2.5 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range . . . . . . . . . . . –40 °C to +85°C Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . . +300 °C ESD (Human Body Model) . . . . . . . . . . . . . . . . . . . . +1500 V NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only, functional operation of the device at these or any other conditions above listed in the operational section of this specification is not implied. Exposure to Absolute Maximum Ratings for any extended periods may affect device reliability. 2 Specification is for device in free air at 25 °C. 8-Lead SOIC Package θ JA = 155 °C/W. 5-Lead SOT-23 Package θ JA = 240 °C/W. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8014 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic. This is approximately +150 °C. Even temporarily ex- ceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the pack- age. Exceeding a junction temperature of +175 °C may result in device failure. The output stage of the AD8014 is designed for large load cur- rent capability. As a result, shorting the output to ground or to power supply sources may result in a very large power dissipa- tion. To ensure proper operation it is necessary to observe the maximum power derating tables. Table I. Maximum Power Dissipation vs. Temperature Ambient Temp Power Watts Power Watts C SOT-23-5 SOIC –40 0.79 1.19 –20 0.71 1.06 0 0.63 0.94 +20 0.54 0.81 +40 0.46 0.69 +60 0.38 0.56 +80 0.29 0.44 +100 0.21 0.31 Rev. C |
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