2

FN3179.7

January 23, 2013

Ordering Information

PART NUMBER

(NOTE 3)

PART MARKING

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

ICL7660SCBA (Note 1)

7660 SCBA

0 to +70

8 Ld SOIC

M8.15

ICL7660SCBAZ

(Notes 1, 2)

7660 SCBAZ

0 to +70

8 Ld SOIC (Pb-free)

M8.15

ICL7660SCPA

7660S CPA

0 to +70

8 Ld PDIP

E8.3

ICL7660SCPAZ (Note 2)

7660S CPAZ

0 to +70

8 Ld PDIP (Pb-free; Note 4)

E8.3

ICL7660SIBA (Note 1)

7660 SIBA

-40 to +85

8 Ld SOIC

M8.15

ICL7660SIBAZ

(Notes 1, 2)

7660 SIBAZ

-40 to +85

8 Ld SOIC (Pb-free)

M8.15

ICL7660SIPA

7660 SIPA

-40 to +85

8 Ld PDIP

E8.3

ICL7660SIPAZ

(Note 2)

7660S IPAZ

-40 to +85

8 Ld PDIP (Pb-free; Note 4)

E8.3

ICL7660ACBA (Note 1)

7660ACBA

0 to 70

8 Ld SOIC (N)

M8.15

ICL7660ACBAZA

(Notes 1, 2)

7660ACBAZ

0 to 70

8 Ld SOIC (N) (Pb-free)

M8.15

ICL7660ACPA

7660ACPA

0 to 70

8 Ld PDIP

E8.3

ICL7660ACPAZ (Note 2)

7660ACPAZ

0 to 70

8 Ld PDIP (Pb-free; Note 4)

E8.3

ICL7660AIBA (Note 1)

7660AIBA

-40 to 85

8 Ld SOIC (N)

M8.15

ICL7660AIBAZA

(Notes 1, 2)

7660AIBAZ

-40 to 85

8 Ld SOIC (N) (Pb-free)

M8.15

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ICL7660S, ICL7660A. For more information on MSL, please see

Tech Brief TB363.

4. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in reflow solder processing applications.

ICL7660S, ICL7660A