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ERTJ0ER103 Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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ERTJ0ER103 Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 8 page Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Multilayer NTC Thermistors – 366 – 1.0 Test Sample 0.5R 0.3/Size:0201 0.5/Size:0402 Board Test Sample Unit : mm 20 45 ±245±2 Unit : mm R340 ■ Specification and Test Method Item Specification Test Method Rated Zero-power Resistance (R25) Within the specified tolerance. The value of the d.c. resistance shall be measured at the rated ambient temperature of 25.0 ±0.1 °C under the power less than 0.1mW which is negligible self heat generation. B Value Within the specified tolerance. ✽ Individual Specification shall specify B25/50 or B25/85. The Zero-power resistances; R1 and R2, shall be measured respectively at T1 (°C) and T2 (°C). The B value is calculated by the following equation. BT1/T2= kn (R1)–kn (R2) 1/(T1+273.15)–1/(T2+273.15) T1 T2 B25/50 25.0 ±0.1 °C 50.0 ±0.1 °C B25/85 25.0 ±0.1 °C 85.0 ±0.1 °C Adhesion The terminal electrode shall be free from peeling or signs of peeling. Applied force : Size 0201 : 2 N Size 0402, 0603 : 5 N Duration : 10 s Size : 0201, 0402 Size : 0603 Bending Strength There shall be no cracks and other mechanical damage. R25 change : within ±5 % Bending distance : 1 mm Bending speed : 1 mm/s Resistance to Soldering Heat There shall be no cracks and other mechanical damage. Nallow Tol. type Standard type R25 change : within ±2 % within ±3 % B Value change : within ±1 % within ±2 % Soldering bath method Solder temperature : 270 ±5 °C Dipping period : 3.0 ±0.5 s Preheat condition : Step Temp (°C) Period (s) 180 to 100 120 to 180 2150 to 200 120 to 180 Solderability More than 75 % of the soldered area of both terminal electrodes shall be covered with fresh solder. Soldering bath method Solder temperature : 230 ±5 °C Dipping period : 4 ±1 s Solder : H63A (JIS–Z–3282) Sep. 2010 00 |
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