bq24295

SLUSBC1 – SEPTEMBER 2013

www.ti.com

THERMAL INFORMATION

RGE PACKAGE

UNITS

24-PIN

Junction-to-ambient thermal resistance

32.2

Junction-to-case (top) thermal resistance

29.8

Junction-to-board thermal resistance

9.1

°C/W

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

9.1

Junction-to-case (bottom) thermal resistance

2.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

space

ELECTRICAL CHARACTERISTICS

noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

QUIESCENT CURRENTS

5

µA

BAT and VBUS

High-Z Mode, or no VBUS, BATFET disabled

Battery discharge current (BAT, SW, SYS)

16

20

µA

(REG07[5] = 1), –40°C – 85°C

High-Z Mode, or no VBUS, BATFET enabled

32

55

µA

(REG07[5] = 0), –40°C – 85°C

15

30

µA

1.5

3

mA

switching

Input supply current (VBUS)

4

mA

3.5

mA

Battery Discharge Current in boost mode

3.5

mA

switching

VBUS/BAT POWER UP

VBUS operating range

3.9

6.2

V

3.6

V

Sleep mode falling threshold

35

80

120

mV

Sleep mode rising threshold

170

250

350

mV

VBUS over-voltage rising threshold

6.2

6.6

V

VBUS Over-Voltage Falling Hysteresis

250

mV

2.3

V

Battery depletion threshold

2.4

2.6

V

Battery depletion rising hysteresis

200

mV

Bad adapter detection threshold

3.8

V

Bad adapter detection current source

30

mA

Bad source detection duration

30

ms

8

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: bq24295