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CRCW0402MFNECHP Datasheet(PDF) 5 Page - Vishay Siliconix

Part # CRCW0402MFNECHP
Description  Pulse Proof, High Power Thick Film Chip Resistors
Download  6 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

CRCW0402MFNECHP Datasheet(HTML) 5 Page - Vishay Siliconix

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CRCW-HP e3
www.vishay.com
Vishay Draloric
Revision: 21-Mar-13
5
Document Number: 20043
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (
R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
1
 to 1 M
CRCW-HP e3
4.5
-
Resistance
-
± 0.5 %, ± 1 %, ± 5 %
4.7
-
Voltage proof
U = 1.4 x Uins; 60 s
-
4.13
-
Short time overload
 2 × U
max.; duration: According to style
± (0.5 % R + 0.05
)
4.17.2
58 (Td)
Solderability
Solder bath method; Sn60Pb40;
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
Good tinning (
 95 % covered)
no visible damage
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
Good tinning (
 95 % covered)
no visible damage
4.8.4.2
-
Temperature coefficient
(20/- 55/20) °C and (20/125/20) °C
± 100 ppm/K, ± 200 ppm/K
4.32
21 (UU3)
Shear (adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
No visible damage
4.33
21 (UU1)
Substrate bending
Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05
)
4.19
14 (Na)
Rapid change of temperature
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
± (0.5 % R + 0.05
)
± (1 % R + 0.05
)
4.23
-
Dry heat
-
± (2 % R + 0.1
)
4.23.2
2 (Ba)
Damp heat, cyclic
125 °C; 16 h
4.23.3
30 (Db)
cold
55 °C;
 90 % RH; 24 h; 1 cycle
4.23.4
1 (Aa)
Low air pressure
- 55 °C; 2 h
4.23.5
13 (M)
-
1 kPa; (25 ± 10) °C; 1 h
4.23.6
30 (Db)
Damp heat, cyclic
55 °C;
 90 % RH; 24 h; 5 cycle
4.23.7
-
D.C. load
4.25.1
-
Endurance at 70 °C
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (2 % R + 0.1
)
± (4 % R + 0.1
)
4.18.2
58 (Td)
Resistance to soldering heat
Solder bath method; (260 ± 5) °C; (10 ± 1) s
± (0.5 % R + 0.05
)
4.35
-
Flammability, needle flame test
IEC 60695-15-5; 10 s
No burning after 30 s
4.24
78 (Cab)
Damp heat, steady state
(40 ± 2) °C; (93 ± 3) % RH; 56 days
± (1 % R + 0.05
)
4.25.3
-
Endurance at
upper category temperature
155 °C; 1000 h
± (2 % R + 0.1
)
4.40
-
Electrostatic discharge
(human body model)
IEC 61340-3-1; 3 positive and 3 negative
discharges; ESD voltage according to size
± (1 % R + 0.05
)
4.29
45 (XA)
Component solvent resistance
Isopropyl alcohol; 50 °C; method 2
No visible damage
4.30
45 (XA)
Solvent resistance of marking
Isopropyl alcohol; 50 °C; method 1;
toothbrush
Marking legible,
no visible damage
4.22
6 (Fc)
Vibration, endurance by sweeping
f = 10 Hz to 2000 Hz; x, y, z
 1.5 mm;
A
 200 m/s2; 10 sweeps per axis
± (0.5 % R + 0.05
)
4.37
-
Periodic electric overload
0.1 s “ON”; 2.5 s “OFF”; 1000 cycles
± (1 % R + 0.05
)
4.27
-
Single pulse high voltage overload,
10 μs/700 μs
10 pulses
± (1 % R + 0.05
)
U
2.5 x
P
70 x R
=
UP
70 x R
=
U
P
70 x R
U
max.
=
U
15 x P
70 x R
2 x U
max.
=
Û
10 x
P
70 x R
2 x U
max.
=


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