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B57311V2221J060 Datasheet(PDF) 4 Page - EPCOS |
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B57311V2221J060 Datasheet(HTML) 4 Page - EPCOS |
4 / 20 page Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Standard Test conditions ∆R 25/R25 (typical) Remarks Storage in dry heat IEC 60068-2-2 JIS C 0021 Storage at upper category temperature T: (125 ±2) °C t: 1000 h < 2% Storage in damp heat, steady state IEC 60068-2-78 JIS C 0022 Temperature of air: (40 ±2) °C Relative humidity of air: (93 +2/ 3)% Duration: 56 days < 2% Rapid temperature cycling IEC 60068-2-14 JIS C 0025 Lower test temperature: 55 °C Upper test temperature: 125 °C Number of cycles: 100 < 2% Endurance Pmax: 180 mW T: (65 ±2) °C t: 1000 h < 2% Solderability IEC 60068-2-58 JIS C 0054 Solderability: (215 ±3) °C, (3 ±0.3) s (235 ±5) °C, (2 ±0.2) s Resistance to soldering heat: (260 ±5) °C, (10 ±1) s 95% of terminations wetted Resistance drift after soldering Reflow soldering profile Wave soldering profile < 1% Temperature measurement and compensation B573**V2 SMD NTC thermistors, case size 0603 (1608) Page 4 of 20 Please read Cautions and warnings and Important notes at the end of this document. |
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