LM2751

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SNVS299B – APRIL 2005 – REVISED MAY 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

−0.3V to 6.0V

EN, CS0, CS1 Pins

w/ 6.0V max

Internally Limited

150°C

Storage Temperature Range

−65°C to 150°C

Maximum Lead Temperature

(Soldering, 10sec.)

265°C

Human-body model

2kV

Machine model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

(5)

The Human body model is a 100 pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin (MIL-STD-883 3015.7).

OPERATING RATINGS

(1) (2)

Input Voltage Range

2.8V to 5.5V

EN, CS0, CS1 Input Voltage Range

-40°C to 115°C

(3)

-40°C to 85°C

Recommended Maximum Load Current

Version B

Freq. = 725kHz

150mA

Freq. = 300kHz

120mA

Freq. = 37kHz

40mA

Freq. = 9.5kHz

10mA

Version A

Freq. = 725kHz

80mA

Freq. = 300kHz

60mA

Freq. = 37kHz

16mA

Freq. = 9.5kHz

4mA

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

THERMAL PROPERTIES

Junction-to-Ambient Thermal

Package (

(1)

Resistance, 10-pin SON

55°C/W

(1)

Junction-to-ambient thermal resistance (

forth in the JEDEC standard JESD51-7. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array

of thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36µm/18µm

/18µm/36µm(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22ºC, still air. Power dissipation is 1W. The value of

LM2751 in 10-pin SON could fall in a range as wide as 50ºC/W to 150ºC/W (if not wider), depending on PWB material, layout, and

to thermal dissipation issues. For more information on these topics, see the TI AN-1187 Application Report (SNOA401) and the Power

Efficiency and Power Dissipation section of this datasheet.

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