TLV2221, TLV2221Y

Advanced LinCMOS RAILTORAIL

VERY LOW POWER SINGLE OPERATIONAL AMPLIFIERS

SLOS157B − JUNE1996 − REVISED APRIL 2005

3−1

WWW.TI.COM

5-V Operation

Includes Negative Rail

2.7 V to 10 V

description

The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a

compromise between the ac performance and output drive of the TLV2231 and the micropower TLV2211.

It consumes only 150

µA (max) of supply current and is ideal for battery-powered applications. The device

exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The

TLV2221 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.

The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for

high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels

combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing

applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great

choice when interfacing with analog-to-digital converters (ADCs).

SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal

source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that

is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage

paths. The OUT and IN− terminals are on the same end of the board to provide negative feedback. Finally, gain

setting resistors and decoupling capacitor are easily placed around the package.

VI

VDD+

OUT

IN −

VDD/GND

IN +

C

RI

RF

GND

V+

VO

1

2

3

4

5

Figure 1. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DBV PACKAGE

(TOP VIEW)

5

4

3

1

2

IN −

VDD−/GND

IN +

VDD+

OUT

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Copyright

 1997 −2005, Texas Instruments Incorporated

Advanced LinCMOS is a trademark of Texas Instruments Incorporated.