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TLE2027MJG Datasheet(PDF) 3 Page - Texas Instruments |
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TLE2027MJG Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 46 page  TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010 3 TLE202xY chip information This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. (1) (2) (3) (4) (5) (6) (7) (8) 90 73 (1) (2) (3) (4) (6) (7) (8) + − OUT IN + IN − VCC+ VCC− OFFSET N1 OFFSET N2 (1) (3) (2) (8) (7) (4) (6) |
Similar Part No. - TLE2027MJG |
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Similar Description - TLE2027MJG |
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