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FAN54042UCX Datasheet(PDF) 5 Page - Fairchild Semiconductor |
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FAN54042UCX Datasheet(HTML) 5 Page - Fairchild Semiconductor |
5 / 41 page © 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN54040 – FAN54047 • Rev. 1.0.2 5 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VBUS Voltage on VBUS Pin Continuous -0.3 28.0 V Pulsed, 100 ms Maximum Non-Repetitive -1.0 VI Voltage on PMID Voltage Pin –0.3 7.0 V Voltage on SW, SYS, VBAT, STAT, DIS Pins –0.3 7.0 VO Voltage on Other Pins –0.3 6.5 (3) V dt dVBUS Maximum VBUS Slope Above 5.5 V when Boost or Charger Active 4 V/ s ESD Electrostatic Discharge Protection Level (4) Human Body Model per JESD22-A114 2000 V Charged Device Model per JESD22-C101 500 IEC 61000-4-2 System ESD USB Connector Pins (VBUS to GND) Air Gap 15 kV Contact 8 TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 3. Lesser of 6.5 V or VI + 0.3 V. 4. Guaranteed if CBUS ≥1µF and CMID ≥ 4.7µF. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Unit VBUS Supply Voltage 4 6 V VBAT(MAX) Maximum Battery Voltage when Boost enabled 4.5 V dt dVBUS Negative VBUS Slew Rate during VBUS Short Circuit, CMID < 4.7 F, see VBUS Short While Charging TA < 60°C 4 V/ s TA > 60°C 2 TA Ambient Temperature –30 +85 °C TJ Junction Temperature (see Thermal Regulation and Protection section) –30 +120 °C Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperature TA. For measured data, see Table 18. Symbol Parameter Typical Unit JA Junction-to-Ambient Thermal Resistance (see also Figure 18) 50 °C/W JB Junction-to-PCB Thermal Resistance 20 °C/W |
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