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07XSC200 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc |
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07XSC200 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 51 page Analog Integrated Circuit Device Data 6 Freescale Semiconductor 07XSC200 THERMAL RATINGS Operating Temperature • Ambient • Junction (5) TA TJ -40 to 125 -40 to 150 C Storage Temperature TSTG -55 to 150 C THERMAL RESISTANCE Thermal Resistance • Junction to Case • Junction to Ambient(6) RJC RJA 4.0 35 C/W Peak Pin Reflow Temperature During Solder Mounting(7) TSOLDER 260 C Notes 5. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not exceed 125 C. 6. Device mounted on a 2s2p test board per JEDEC JESD51-2. 20 °C/W of RθJA can be reached in a real application case (4 layers board). 7. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit |
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