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OPA2277AIDRM Datasheet(PDF) 11 Page - Texas Instruments |
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OPA2277AIDRM Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 27 page  OPA277, OPA2277, OPA4277 11 SBOS079A www.ti.com DFN PACKAGE The OPA277 series uses the 8-lead DFN (also known as SON), which is a QFN package with contacts on only two sides of the package bottom. This leadless, near-chip-scale package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. DFN packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics, with a pinout scheme that is consistent with other commonly-used packages, such as SO and MSOP. Addition- ally, the absence of external leads eliminates bent-lead issues. The DFN package can be easily mounted using standard printed circuit board (PCB) assembly techniques. See Appli- cation Note, QFN/SON PCB Attachment (SLUA271) and Application Report, Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com. The exposed leadframe die pad on the bottom of the package should be connected to V–. LAYOUT GUIDELINES The leadframe die pad should be soldered to a thermal pad on the PCB. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long- term reliability. |
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