OPA277, OPA2277, OPA4277

2

SBOS079A

www.ti.com

OFFSET

OFFSET

VOLTAGE

VOLTAGE DRIFT

PRODUCT

max,

max,

PACKAGE-LEAD

Single

OPA277PA

±50

±1

DIP-8

OPA277P

±20

±0.15

DIP-8

OPA277UA

±50

±1

SO-8 Surface Mount

OPA277U

±20

±0.15

SO-8 Surface Mount

OPA277AIDRM

±100

±1

DFN-8 (4mm x 4mm)

Dual

OPA2277PA

±50

±1

DIP-8

OPA2277P

±25

±0.25

DIP-8

OPA2277UA

±50

±1

SO-8 Surface Mount

OPA2277U

±25

±0.25

SO-8 Surface Mount

OPA2277AIDRM

±100

±1

DFN-8 (4mm x 4mm)

Quad

OPA4277PA

±50

±1

DIP-14

OPA4277UA

±50

±1

SO-14 Surface Mount

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet or visit the TI web site

at www.ti.com.

Supply Voltage .................................................................................... 36V

Input Voltage ..................................................... (V–) –0.7V to (V+) +0.7V

Operating Temperature .................................................. –55

°C to +125°C

Storage Temperature ..................................................... –55

°C to +125°C

Junction Temperature ...................................................................... 150

°C

Lead Temperature (soldering, 10s) ................................................. 300

°C

ESD Rating (Human Body Model) .................................................. 2000V

(Machine Model) ........................................................... 100V

NOTE: (1) Stresses above these rating may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. (2) Short-circuit to ground, one amplifier per package.

PIN DESCRIPTIONS

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

1

2

3

4

5

6

7

14

13

12

11

10

9

8

Out D

–In D

+In D

V–

+In C

–In C

Out C

Out A

–In A

+In A

V+

+In B

–In B

Out B

OPA4277

14-Pin DIP, SO-14

AD

BC

1

2

3

4

8

7

6

5

V+

Out B

–In B

+In B

Out A

–In A

+In A

V–

OPA2277

8-Pin DIP, SO-8

A

B

1

2

3

4

8

7

6

5

Offset Trim

V+

Output

Offset Trim

–In

+In

V–

OPA277

8-Pin DIP, SO-8

1

2

3

4

Out A

−In A

+In A

V

−

8

7

6

5

Out B

Pin 1

Indicator

OPA2277AIDRM

DFN-8 4mm x 4mm

(top view)

V+

−In B

Thermal Pad

on Bottom

(Connect to V

−)

+In B

1

2

3

4

Offset Trim

−In

+In

V

−

8

7

6

5

Offset Trim

Pin 1

Indicator

OPA277AIDRM

DFN-8 4mm x 4mm

(top view)

V+

Output

Thermal Pad

on Bottom

(Connect to V

−)

NC

NOTE: (1) NC = No connection.