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OPA2277UAE4 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA2277UAE4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page OPA277, OPA2277, OPA4277 2 SBOS079A www.ti.com OFFSET OFFSET VOLTAGE VOLTAGE DRIFT PRODUCT max, µV max, µV/°C PACKAGE-LEAD Single OPA277PA ±50 ±1 DIP-8 OPA277P ±20 ±0.15 DIP-8 OPA277UA ±50 ±1 SO-8 Surface Mount OPA277U ±20 ±0.15 SO-8 Surface Mount OPA277AIDRM ±100 ±1 DFN-8 (4mm x 4mm) Dual OPA2277PA ±50 ±1 DIP-8 OPA2277P ±25 ±0.25 DIP-8 OPA2277UA ±50 ±1 SO-8 Surface Mount OPA2277U ±25 ±0.25 SO-8 Surface Mount OPA2277AIDRM ±100 ±1 DFN-8 (4mm x 4mm) Quad OPA4277PA ±50 ±1 DIP-14 OPA4277UA ±50 ±1 SO-14 Surface Mount NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet or visit the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage .................................................................................... 36V Input Voltage ..................................................... (V–) –0.7V to (V+) +0.7V Output Short-Circuit(2) .............................................................. Continuous Operating Temperature .................................................. –55 °C to +125°C Storage Temperature ..................................................... –55 °C to +125°C Junction Temperature ...................................................................... 150 °C Lead Temperature (soldering, 10s) ................................................. 300 °C ESD Rating (Human Body Model) .................................................. 2000V (Machine Model) ........................................................... 100V NOTE: (1) Stresses above these rating may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Short-circuit to ground, one amplifier per package. PACKAGE/ORDERING INFORMATION(1) PIN DESCRIPTIONS ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 1 2 3 4 5 6 7 14 13 12 11 10 9 8 Out D –In D +In D V– +In C –In C Out C Out A –In A +In A V+ +In B –In B Out B OPA4277 14-Pin DIP, SO-14 AD BC 1 2 3 4 8 7 6 5 V+ Out B –In B +In B Out A –In A +In A V– OPA2277 8-Pin DIP, SO-8 A B 1 2 3 4 8 7 6 5 Offset Trim V+ Output NC(1) Offset Trim –In +In V– OPA277 8-Pin DIP, SO-8 1 2 3 4 Out A −In A +In A V − 8 7 6 5 Out B Pin 1 Indicator OPA2277AIDRM DFN-8 4mm x 4mm (top view) V+ −In B Thermal Pad on Bottom (Connect to V −) +In B 1 2 3 4 Offset Trim −In +In V − 8 7 6 5 Offset Trim Pin 1 Indicator OPA277AIDRM DFN-8 4mm x 4mm (top view) V+ Output Thermal Pad on Bottom (Connect to V −) NC NOTE: (1) NC = No connection. |
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