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74LVX3245QSC Datasheet(PDF) 8 Page - Fairchild Semiconductor |
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74LVX3245QSC Datasheet(HTML) 8 Page - Fairchild Semiconductor |
8 / 9 page D ATE 10/97. MTC 24REV4 1 12 B 24 13 A DETAIL 12° TOP & BO TTO M 0.75 0.45 8° 0°- 1 12 13 24 R0.09M IN (1.00) 0.65 TYP 0.20 CB A 0.10 C B Z 0.10 C 7.8±0.1 0.20 TYP A 0.65 www.fairchildsemi.com 8 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fair- child Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. |
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