Electronic Components Datasheet Search |
|
TLE2021MJG Datasheet(PDF) 5 Page - Texas Instruments |
|
|
TLE2021MJG Datasheet(HTML) 5 Page - Texas Instruments |
5 / 77 page TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2022Y chip information This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + − OUT IN + IN − VCC+ (8) (6) (3) (2) (5) (1) − + (7) IN + IN − OUT (4) VCC− 80 86 (1) (2) (3) (4) (5) (6) (7) (8) |
Similar Part No. - TLE2021MJG |
|
Similar Description - TLE2021MJG |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |