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SI6426 Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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SI6426 Datasheet(HTML) 2 Page - Fairchild Semiconductor |
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2 / 5 page  Si6426DQ Rev B(W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA 20 V ∆BVDSS ∆TJ Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 14 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = 20 V, VGS = 0 V 1 µA VDS = 20 V, VGS = 0 V, TJ=55 °C 5 IGSSF Gate–Body Leakage, Forward VGS = 8 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –8 V, VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 0.6 0.9 1.5 V ∆VGS(th) ∆TJ Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C –3 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = 4.5 V, ID = 5.4 A VGS = 2.5 V, ID = 4.9 A 23 33 35 40 m Ω ID(on) On–State Drain Current VGS = 4.5 V, VDS = 5 V 20 A VGS = 2.5 V, VDS = 5 V 8 gFS Forward Transconductance VDS = 10 V, ID = 5.4 A 11 S Dynamic Characteristics Ciss Input Capacitance 710 pF Coss Output Capacitance 173 pF Crss Reverse Transfer Capacitance VDS = 10 V, V GS = 0 V, f = 1.0 MHz 84 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 7 14 ns tr Turn–On Rise Time 17 31 ns td(off) Turn–Off Delay Time 16 29 ns tf Turn–Off Fall Time VDD = 6 V, ID = 1 A, VGS = 4.5 V, RGEN = 6 Ω 3 6 ns trr Reverse Recovery Time VGS = 0 V, IF = 1.5 A, dIF/dt = 100A/ µs 14 100 ns Qg Total Gate Charge 7 10 nC Qgs Gate–Source Charge 1.5 nC Qgd Gate–Drain Charge VDS = 6 V, ID = 5.4 A, VGS = 4.5 V 1.2 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 1.25 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 1.25 A (Note 2) 0.7 1.2 V Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while RθCA is determined by the user's board design. a) 87°C/W when mounted on a 1in 2 pad of 2 oz copper. b) 114°C/W when mounted on a minimum pad of 2 oz copper. c) Scale 1 : 1 on letter size paper 2.Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
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Similar Description - SI6426 |
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