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SPT7610 Datasheet(PDF) 8 Page - Fairchild Semiconductor |
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SPT7610 Datasheet(HTML) 8 Page - Fairchild Semiconductor |
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8 / 10 page  8 1/21/02 SPT7610 SUBCIRCUIT SCHEMATICS Figure 3A – Input Circuit Figure 3B – Output Circuit Figure 3C – Clock Input Data Out AGND DGND AGND AVEE VIN Vr AGND AVEE CLK CLK THERMAL MANAGEMENT Adequate heat sinking and air flow must be provided to keep the die temperature below +150 °C. This device is packaged with the cavity up (the die is on the bottom of the package). Therefore, Fairchild recommends that the device be heat sinked by contacting the bottom of the package through a hole in the circuit board. The thermal coefficients of the SPT7610 (44L cerquad) are as follows: θja = +78 °C/W (junction to ambient in still air with no heat sink) θjc = +4 °C/W (junction to case) |
Similar Part No. - SPT7610 |
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Similar Description - SPT7610 |
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