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AD532JD Datasheet(PDF) 6 Page - Analog Devices |
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AD532JD Datasheet(HTML) 6 Page - Analog Devices |
6 / 17 page AD532 Rev. D | Page 5 of 16 THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 2. Thermal Resistance Package Type θ JA θ JC Unit H-10A 150 25 °C/W E-20A 85 22 °C/W D-14 85 22 °C/W CHIP DIMENSIONS AND BONDING DIAGRAM Contact factory for latest dimensions. Dimensions are shown in inches and (mm). 0.062 (1.575) GND Z 0.107 (2.718) –VS +VS Y1 Y2 X2 X1 VOS OUTPUT Figure 2. ESD CAUTION |
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