Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Nov., 2006

APL1187

www.anpec.com.tw

8

Terminal Material

Solder-Plated Copper (Solder Material: 90/10 or 63/37 SnPb), 100%Sn

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Physical Specifications

Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate

3

°C/second max.

3

°C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

Time maintained above:

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak/Classificatioon Temperature (Tp)

See table 1

See table 2

Time within 5

°C of actual

Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-down Rate

6

°C/second max.

6

°C/second max.

Time 25

°C to Peak Temperature

6 minutes max.

8 minutes max.

Notes: All temperatures refer to topside of the package. Measured on the body surface.

t 25 C to Peak

tp

Ramp-up

t

L

Ramp-down

ts

Preheat

Tsmax

Tsmin

T

L

T

P

25

Time

Critical Zone

T

°