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APL158115KAC-TRG Datasheet(PDF) 10 Page - Anpec Electronics Coropration |
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APL158115KAC-TRG Datasheet(HTML) 10 Page - Anpec Electronics Coropration |
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10 / 20 page  Copyright © ANPEC Electronics Corp. Rev. B.8 - Jan., 2012 APL1581 www.anpec.com.tw 10 Figure 2. Remote Voltage Sensing VIN VCNTL VOUT VSENSE V OUT V IN V CNTL GND APL1581 Load RP Fixed Voltage Device Grounding and Output Sensing (Cont.) Application Information (Cont.) Stability and Output Capacitors The circuit design of using the APL1581 series requires an output capacitor as part of the device frequency compensation. The following chart shows a stable re- gion to select output capacitor for APL1581. This region above the curve indicates minimum required ESR and capacitance to maintain stability. However, the output ca- pacitor should have an ESR less than 1 Ω. Capacitance( µF) Stable Region 0 20 40 60 80 100 1 10 100 1000 A low-ESR solid tantalum and aluminum electrolytic ca- pacitor (ESR<1 Ω) works extremely well and provides good transient response and stability over temperature. Ultra- low-ESR capacitors, such as ceramic chip capacitors, may promote unstable or under-damped transient response, but proper ceramic chip capacitors placed near loads can be used as decoupling capacitors. The output capacitors are also used to reduce the slew rate of load current and help the APL1581 to minimize variations of the output voltage, improving transient response. For this purpose, the low-ESR capacitors are recommended. Input Capacitors The input capacitors of VCNTL and VIN pins are not re- quired for stability but for supplying surge currents during large load transients, and this will prevent the input rail from drooping and improve the performance of the APL1581. Because parasitic inductors from voltage sources or other bulk capacitors to the VCNTL and VIN pins will limit the slew rate of the surge currents during large load transients, resulting in voltage drop at VIN and VCNTL pins. A capacitor of 1 µF (ceramic chip capacitor) or greater (aluminum electrolytic capacitor) is recommended and connected near VCNTL pin. For VIN pin, an aluminum electrolytic capacitor (>33 µF) is recommended. It is not necessary to use low-ESR capacitors. More capacitance reduces the variations of the input voltage at VIN pin. Layout and Thermal Consideration The APL1581 series have internal power and thermal limiting (T J=150 oC typical) circuitry designed to protect the device under overload conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load conditions. Careful con- sideration must be given to all sources of thermal resis- tance from junction to ambient, including junction-to-case, case-to-heat sink interface, and heat sink resistance itself. See Figure 3, the SOP-8P is a cost-effective package featuring a small size as a standard SOP-8 and a bottom thermal pad to minimize the thermal resistance of the package, being applicable to high current applications. The thermal pad is soldered to the top VOUT plane which may be connected to internal or bottom VOUT plane by vias to reduce the heat sink thermal resistance. Therefore, the printed circuit board (PCB) forms a heat sink and dissipates heat into ambient air. |
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