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APL560328KI-TRG Datasheet(PDF) 10 Page - Anpec Electronics Coropration |
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APL560328KI-TRG Datasheet(HTML) 10 Page - Anpec Electronics Coropration |
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10 / 19 page  Copyright © ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 www.anpec.com.tw 10 APL5603 Application Information Layout Consideration Figure 1 illustrates the layout. Below is a checklist for your layout: 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the load as close as possible. 3. To place APL5603 and output capacitors near the load is good for performance. 4. Large current paths, the bold lines in figure 1, must have wide tracks. Input Capacitor The APL5603 requires proper input capacitors to supply surge current during stepping load transients to prevent the input rail from dropping. Because the parasitic induc- tor from the voltage sources or other bulk capacitors to the VIN limits the slew rate of the surge current, it is nec- essary to place the input capacitors near VIN as close as possible. Input capacitors should be larger than 0.82 µF. Output Capacitor The APL5603 needs a proper output capacitor to main- tain circuit stability and to improve transient response over-temperature and current. In order to insure the cir- cuit stability, the proper output capacitor value should be larger than 1 µF. With X5R and X7R dielectrics, 2.2µF is sufficient at all operating temperatures. Maximum output capacitor should be less than 330 µF to insure the sys- tem can be powered on effectively. The APL5603 maximum power dissipation depends on the thermal resistance and temperature difference be- tween the die junction and ambient air. The power dissi- pation P D across the device is: P D = (TJ - TA) / θJA where (T J-TA) is the temperature difference between the junction and ambient air. θ JA is the thermal resistance between junction and ambient air. Assuming the T A=25 oC and maximum T J=150 oC (typical thermal limit threshold), the maximum power dissipation is calculated as: P D(max)=(150-25)/260 = 0.48(W) For normal operation, do not exceed the maximum oper- ating junction temperature of T J = 125 oC. The calculated power dissipation should be less than: P D =(125-25)/260 = 0.38(W) The GND provides an electrical connection to ground and channels heat away. Connect the GND to the ground by using a large pad or ground plane. Operation Region and Power Dissipation Figure 1. Large ground plane is good for heating. Optimum perfor- mance can only be achieved when the device is mounted on a PC board according to the Board layout diagrams which are shown as Figure2, 3, and 4. Figure 2. Figure 3 . Figure 4. VIN VOUT GND APL5603 C IN C OUT V IN V OUT EN V EN SOT-23-5 C IN C OUT V OUT GND DFN3X3-8 V OUT V IN GND C IN C OUT For dissipating heat SOP-8 GND V OUT V IN GND C IN C OUT For dissipating heat |
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