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TB6560AHQ Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # TB6560AHQ
Description  PWM Chopper-Type Bipolar Driver IC for Stepping Motor Control
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TB6560AHQ Datasheet(HTML) 1 Page - Toshiba Semiconductor

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TB6560AHQ/AFG
2011-01-18
1
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB6560AHQ, TB6560AFG
PWM Chopper-Type Bipolar Driver IC for Stepping Motor Control
The TB6560AHQ/AFG is a PWM chopper-type stepping motor
driver IC designed for sinusoidal-input microstep control of
bipolar stepping motors. The TB6560AHQ/AFG can be used in
applications that require 2-phase, 1-2-phase, 2W1-2-phase and
4W1-2-phase excitation modes. The TB6560AHQ/AFG is capable
of low-vibration, high-performance forward and reverse driving of
a two-phase bipolar stepping motor using only a clock signal.
Features
• Single-chip motor driver for sinusoidal microstep control of
stepping motors
• High output withstand voltage due to the use of BiCD process:
Ron (upper and lower sum) =
TB6560AHQ: 0.6
Ω (typ.)
TB6560AFG: 0.7
Ω (typ.)
• Forward and reverse rotation
• Selectable phase excitation modes (2, 1-2, 2W1-2 and 4W1-2)
• High output withstand voltage: VDSS = 40 V
• High output current: IOUT = TB6560AHQ: 3.5 A (peak)
TB6560AFG: 2.5 A (peak)
• Packages: HZIP25-P-1.27
HQFP64-P-1010-0.50
• Internal pull-down resistors on inputs: 100 kΩ (typ.)
• Output monitor pin: MO current (IMO (max) = 1 mA)
• Reset and enable pins
• Thermal shutdown (TSD)
*: These ICs are highly sensitive to electrostatic discharge. When handling them, ensure that the environment is
protected against electrostatic discharge. Ensure also that the ambient temperature and relative humidity are
maintained at reasonable level.
TB6560AHQ
TB6560AFG
Weight
HZIP25-P-1.27: 9.86 g (typ.)
HQFP64-P-1010-0.50: 0.26 g (typ.)
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature
= 230°C
*dipping time
= 5 seconds
*number of times
= once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature
= 245°C
*dipping time
= 5 seconds
*the number of times
= once
*use of R-type flux


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