Electronic Components Datasheet Search |
|
APA2068KAI-TRG Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
|
APA2068KAI-TRG Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
2 / 24 page Copyright © ANPEC Electronics Corp. Rev. A.8 - May., 2012 APA2068 www.anpec.com.tw 2 Symbol Parameter Rating Unit VDD Supply Voltage Range -0.3 to 6 V VIN Input Voltage Range, SE/BTL, SHUTDOWN, MUTE -0.3 to VDD+0.3 V TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -65 to +150 °C TSDR Maximum Lead Soldering Temperature,10 Seconds 260 °C PD Power Dissipation Internal Limited W Symbol Parameter Typical Value Unit θ JA Thermal Resistance from Junction to Ambient (Note 2) SOP-16P 45 °C/W θ JC Thermal Resistance from Junction to Case (Note 3) SOP-16P 10 °C/W Range Symbol Parameter Min. Max. Unit VDD Supply Voltage 4.5 5.5 V TA Operating Ambient Temperature Range -40 85 °C TJ Operating Junction Temperature - 125 °C SHUTDOWN, MUTE 2 - VIH High Level Threshold Voltage SE/BTL 4 - V (Over operating free-air temperature range unless otherwise noted.) Absolute Maximum Ratings (Note 1) Recommended Operating Conditions Thermal Characteristics Pin Configuration Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 2: The Thermal-Pad on the bottom of the IC should soldered directly to the PCB’s Thermal-Pad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz copper thickness. Note 3: The case temperature is measured at the center of the Thermal-Pad on the underside of the SOP-16P package. BYPASS 4 13 SE/BTL VOLMAX 8 GND 5 15 VDD LIN- 6 12 GND SHUTDOWN 2 14 ROUT+ RIN- 3 16 ROUT- 11 LOUT+ 10 VDD VOLUME 7 MUTE 1 9 LOUT- APA2068 = Thermal Pad (Connected to GND for better heat dissipation) |
Similar Part No. - APA2068KAI-TRG |
|
Similar Description - APA2068KAI-TRG |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |