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APA2175QI-TRG Datasheet(PDF) 3 Page - Anpec Electronics Coropration |
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APA2175QI-TRG Datasheet(HTML) 3 Page - Anpec Electronics Coropration |
3 / 19 page Copyright © ANPEC Electronics Corp. Rev. A.3 - Jul., 2010 www.anpec.com.tw 3 APA2175 Absolute Maximum Ratings (Cont.) (Note 1) Symbol Parameter Rating Unit VOUT ROUT and LOUT to GND Voltage VSS-0.3 to VDD+0.3 VCPP CPP to PGND Voltage PGND-0.3 to PVDD+0.3 VCPN CPN to PGND Voltage PVSS-0.3 to PGND+0.3 V TJ Maximum Junction Temperature 150 TSTG Storage Temperature Range -65 to +150 TSDR Maximum Soldering Temperature Range, 10 Seconds 260 οC PD Power Dissipation Internally Limited W Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Range Symbol Parameter Min. Max. Unit VDD Supply Voltage 2.3 4.5 VIH High Level Threshold Voltage RSD, LSD 1 - VIL Low Level Threshold Voltage RSD, LSD - 0.35 V TA Operating Ambient Temperature Range -40 85 TJ Operating Junction Temperature Range -40 125 οC APA2175 Symbol Parameter Test Conditions Min. Typ. Max. Unit IDD VDD Supply Current - 5 10 mA ISD VDD Shutdown Current VRSD=VLSD=0V - 1 5 µA Ii Input current RSD, LSD - 0.1 - µA Recommended Operating Conditions Electrical Characteristics V DD=3.3V, VRSD=VLSD=VDD, CCPF=CCPO=2.2µF, Ci=1µF, TA=25 oC (unless otherwise noted) Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Thermal Resistance - Junction to Ambient (Note 2) TQFN4x4-20B TSSOP-16 45 100 oC/W θ JC Thermal Resistance - Junction to Case (Note 3) TQFN4x4-20B 8 oC/W Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s Thermal Pad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz copper thickness. Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the TQFN4x4-20B package. |
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