Copyright

© ANPEC Electronics Corp.

Rev. A.10 - Aug., 2013

www.anpec.com.tw

3

APA2030/2031

Symbol

Parameter

Rating

Unit

Supply Voltage Range, VDD, PVDD

-0.3V to 6V

V

Input Voltage Range at SE/BTL, HP/LINE, SHUTDOWN,

V

Operating Ambient Temperature Range

-40

Maximum Junction Temperature

Internal Limited

Storage Temperature Range

-65

Maximum Lead Soldering Temperature, 10 Seconds

260

Power dissipation

Internal Limited

(Over operating free-air temperature range unless otherwise noted.)

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance from Junction to Ambient in Free Air

(Note 2)

TSSOP-24P

TSSOP-20P

TQFN3x3-16

45

48

55

Note 2 :

θ

board with 2oz trace and copper pad through 9 25mil diameter vias. The thermal pad on the TSSOP_P and TQFN3x3-16 packages with

solder on the printed circuit board.

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

Supply Voltage

4.5V to 5.5V

V

Electrical Characteristics

(V

APA2030 / 2031

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Supply Voltage

3.3

-

5.5

V

SE/BTL = 0V

-

6

12

mA

Supply Current

SE/BTL = 5V

-

4

8

mA

Supply Current in Shutdown Mode SHUTDOWN = 0V

-

50

300

µA

SHUTDOWN, GAIN0, GAIN1

2

-

-

V

High Level Threshold Voltage

SE/BTL, HP/LINE

4

-

-

V

SHUTDOWN, GAIN0, GAIN1

-

-

0.8

V

Low level Threshold Voltage

SE/BTL, HP/LINE

-

-

3

V