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TPS79625KTTRG3 Datasheet(PDF) 11 Page - Texas Instruments |
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TPS79625KTTRG3 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 30 page R q JA + ()125OC * TA) P D 160 140 120 100 80 60 40 20 0 0 1 2 3 4 5 6 7 8 9 10 Board Copper Area ( ) in 2 DCQ DRB KTT P D + VIN * VOUT I OUT TPS796 www.ti.com SLVS351O – SEPTEMBER 2002 – REVISED NOVEMBER 2013 THERMAL INFORMATION Knowing the maximum RθJA, the minimum amount of POWER DISSIPATION PCB copper area needed for appropriate heatsinking can be estimated using Figure 24. Knowing the device power dissipation and proper sizing of the thermal plane that is connected to the tab or pad is critical to avoiding thermal shutdown and ensuring reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated using Equation 4: (4) Power dissipation can be minimized and greater efficiency can be achieved by using the lowest possible input voltage necessary to achieve the required output voltage regulation. On the SON (DRB) package, the primary conduction path for heat is through the exposed pad to the printed circuit board (PCB). The pad can be Note: θJA value at board size of 9in 2 (that is, 3in × connected to ground or be left floating; however, it 3in) is a JEDEC standard. should be attached to an appropriate amount of copper PCB area to ensure the device does not Figure 24. θJA vs Board Size overheat. On both SOT-223 (DCQ) and DDPAK (KTT) packages, the primary conduction path for heat Figure 24 shows the variation of θJA as a function of is through the tab to the PCB. That tab should be ground plane copper area in the board. It is intended connected to ground. The maximum junction-to- only as a guideline to demonstrate the effects of heat ambient thermal resistance depends on the maximum spreading in the ground plane and should not be ambient temperature, maximum device junction used to estimate actual thermal performance in real temperature, and power dissipation of the device and application environments. can be calculated using Equation 5: NOTE: When the device is mounted on an application PCB, it is strongly recommended to use (5) ΨJT and ΨJB, as explained in the Estimating Junction Temperature section. Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 |
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