MC10EP08, MC100EP08

http://onsemi.com

11

PACKAGE DIMENSIONS

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

2.90

3.10

0.114

0.122

B

2.90

3.10

0.114

0.122

C

0.80

1.10

0.031

0.043

D

0.05

0.15

0.002

0.006

F

0.40

0.70

0.016

0.028

G

0.65 BSC

0.026 BSC

L

4.90 BSC

0.193 BSC

M

0

6

0

6

__

_

_

SEATING

PLANE

PIN 1

1

4

85

DETAIL E

B

C

D

A

G

DETAIL E

F

M

L

2X

L/2

−U−

S

U

0.15 (0.006) T

S

U

0.15 (0.006) T

S

U

M

0.10 (0.004)

T

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

8x

REF

K

IDENT

K

0.25

0.40

0.010

0.016

TSSOP−8

DT SUFFIX

CASE 948R−02

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

6. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE -W-.

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MC10EP08/D

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