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Si7013-A10-YM Datasheet(PDF) 11 Page - Silicon Laboratories |
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Si7013-A10-YM Datasheet(HTML) 11 Page - Silicon Laboratories |
11 / 43 page Si7013 Rev. 0.95 11 Table 7. Thermal Characteristics Parameter Symbol Test Condition DFN-6 Unit Junction to Air Thermal Resistance JA JEDEC 2-Layer board, No Airflow 236 °C/W Junction to Air Thermal Resistance JA JEDEC 2-Layer board, 1 m/s Airflow 203 °C/W Junction to Air Thermal Resistance JA JEDEC 2-Layer board, 2.5 m/s Airflow 191 °C/W Junction to Case Thermal Resistance JC JEDEC 2-Layer board 20 °C/W Junction to Board Thermal Resistance JB JEDEC 2-Layer board 112 °C/W Table 8. Absolute Maximum Ratings1 Parameter Symbol Test Condition Min Typ Max Unit Ambient temperature under bias –55 — 125 °C Storage TemperatureFigure 2 –65 — 150 °C Voltage on I/O pins –0.3 — VDD+0.3V V Voltage on VDD with respect to GND –0.3 — 4.2 V Notes: 1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may shorten the life of the device or alter its performance. 2. Special handling considerations apply; see application note, “AN607: Si70xx Humidity Sensor Designer’s Guide” for details. |
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