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TMX320C6454BZTZ7 Datasheet(PDF) 7 Page - Texas Instruments |
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TMX320C6454BZTZ7 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 232 page  TMS320C6454 www.ti.com SPRS311I – APRIL 2006 – REVISED MARCH 2012 2 Device Overview 2.1 Device Characteristics Table 2-1, provides an overview of the C6454 DSP. The tables show significant features of the C6454 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count. Table 2-1. Characteristics of the C6454 Processor HARDWARE FEATURES C6454 EMIFA (64-bit bus width) 1 (clock source = AECLKIN or SYSCLK4) DDR2 Memory Controller (32-bit bus width) [1.8 V I/O] 1 (clock source = CLKIN2) EDMA3 (64 independent channels) [CPU/3 clock rate] 1 I2C 1 Peripherals HPI (32- or 16-bit user selectable) 1 (HPI16 or HPI32) Not all peripherals pins are available at the same PCI (32-bit), [66-MHz or 33-MHz] 1 (PCI66 or PCI33) time (For more detail, see McBSPs (internal CPU/6 or external clock source up Section 3, Device 2 to 100 Mbps) Configuration). 10/100/1000 Ethernet MAC (EMAC) 1 Management Data Input/Output (MDIO) 1 64-Bit Timers (Configurable) 2 64-bit or 4 32-bit (internal clock source = CPU/6 clock frequency) General-Purpose Input/Output Port (GPIO) 16 Size (Bytes) 1144K 32K-Byte (32KB) L1 Program Memory Controller [SRAM/Cache] On-Chip Memory Organization 32KB Data Memory Controller [SRAM/Cache] 1024KB L2 Unified Memory/Cache 32KB L2 ROM C64x+ Megamodule Megamodule Revision ID Register (address location: See Section 5.6, Megamodule Revision Revision ID 0181 2000h) See Section 3.6, JTAG ID (JTAGID) Register JTAG BSDL_ID JTAGID register (address location: 0x02A80008) Description Frequency MHz 720, 850, and 1000 (1 GHz) 1.39 ns (C6454-720), 1.17 ns (C6454-850), Cycle Time ns 1 ns (C6454 A-1000, -1000) [1-GHz CPU](1) 1.25 V (A-1000/-1000) Core (V) 1.2 V (-850/-720) Voltage 1.5/1.8 [EMAC RGMII], and I/O (V) 1.8 and 3.3 V [I/O Supply Voltage] PLL1 and PLL1 CLKIN1 frequency multiplier Bypass (x1), x15, x20, x25, x30, x32 Controller Options CLKIN2 frequency multiplier PLL2 x20 [DDR2 Memory Controller and EMAC support only] 697-Pin Flip-Chip Plastic BGA (CTZ) BGA Package 24 x 24 mm 697-Pin Plastic BGA (GTZ) 697-Pin Flip-Chip Plastic BGA (ZTZ) Process Technology μm 0.09 μm Product Preview (PP), Advance Information (AI), Product Status(2) PD or Production Data (PD) (1) The extended temperature device's (A-1000) electrical characteristics and ac timings are the same as those for the corresponding commercial temperature devices (-1000). (2) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2012, Texas Instruments Incorporated Device Overview 7 Submit Documentation Feedback Product Folder Link(s): TMS320C6454 |
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