ECJ-0EX1C104K datasheet(6/25 Pages) PANASONIC

Part #	ECJ-0EX1C104K

Description	PRODUCT SPECIFICATION FOR APPROVAL

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Manufacturer	PANASONIC [Panasonic Semiconductor]

Direct Link	http://www.panasonic.com/industrial/

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Dec 9, 2005

Note ;

CLASSIFICATION

SPECIFICATIONS

No.

SUBJECT

PAGE

DATE

151S-ECJ-KGM80E

Multilayer Ceramic Chip Capacitors10 type (EIA 0402)

(P/N : ECJ0EX1C104K) Common Specification

Table 2

No

Contents

Performance

Test Method

Appear-

ance

There shall be no cracks and other

mechanical damage.

Temp.

Char.

Change from the value

before test.

9

Bending

Strength

Capaci-

tance

X7R

Within +/- 12.5%

After soldering capacitor on the substrate 1mm

of bending shall be applied for 5 seconds.

Bending speed : 1mm/s

(shown in Fig. 3)

Appear-

ance

There shall be no cracks and other

mechanical damage.

Capaci-

tance

Shall be within the specified tolerance.

10

Vibration

Proof

tan

δ

Shall meet the specified initial value.

Solder the specimen to the testing jig shown

in Fig. 2. Apply a variable vibration of 1.5mm

total amplitude in the 10 to 55 to10Hz vibration

frequency range swept in 1 min. in 3 mutually

perpendicular directions for 2 hours each, a

total of 6 hours.

Appear-

ance

There shall be no cracks and other

mechanical damage.

Temp.

Char.

Change from the value

before test.

Capaci-

tance

X7R

Within +/- 7.5%

tan

δ

Shall meet the specified initial value.

I.R.

Shall meet the specified initial value.

11

Resistance

to

Solder

Heat

With-

stand

voltage

There shall be no dielectric breakdown

or damage.

Solder both method

Preconditioning : Heat Temperature

(See 5.1.1)/Class2

Solder temperature : 270+/-5°C

Dipping period : 3+/-0.5s

Preheat condition :

Use solder H63A(JIS-Z-3282).For the flux,

use rosin (JIS-K-5902) ethanol solution of a

concentration of about 25% by weight. Use

tweezers for the holder to dip the specimen.

Recovery : 48+/-4 hours

12

Solderability

More than 95% of the soldered area of

both terminal electrodes shall be

covered with fresh solder.

Solder temperature : 230+/-5°C

Dipping period : 4+/-1s

Dip the specimen in solder so that both

terminal electrodes are completely submerged.

Use solder H63A(JIS-Z-3282). For the flux use

rosin (JIS-K-5902) of ethanol solution of a

concentration of about 25% by weight.

Use tweezers for the holder to dip the

specimen.

(continue)

Order

Temp.(°C)

Period(s)

1

80 to 100

120 to 180

2

150 to 200

120 to 180

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