bq771600, bq771601, bq771602, bq771604

SLUSAX0A – DECEMBER 2012 – REVISED SEPTEMBER 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

Package

OV Hysteresis

Tape and Reel

Tape and Reel

Part Number

Package

OVP (V)

Output Drive

Designator

(V)

(Large)

(Small)

bq771600

4.300

0.300

CMOS Active High

bq771600DPJR

bq771600DPJT

bq771601

4.225

0.050

CMOS Active High

bq771601DPJR

bq771601DPJT

NCH Active Low, Open

bq771602

4.225

0.050

bq771602DPJR

bq771602DPJT

Drain

NCH Active Low, Open

bq771603

(1)

4.325

0.050

bq771603DPJR

bq771603DPJT

Drain

bq771604

4.200

0.050

CMOS Active High

bq771604DPJR

bq771604DPJT

bq771605

(1)

3.850

0.250

NCH Active Low

bq771605DPJR

bq771605DPJT

bq771607

(1)

4.200

0.250

CMOS Active High

bq771607DPJR

bq771607DPJT

bq771608

(1)

4.225

0.250

CMOS Active High

bq771608DPJR

bq771608DPJT

–40°C to 110°C

8-pin QFN

DPJ

bq771609

(1)

4.250

0.050

CMOS Active High

bq771609DPJR

bq771609DPJT

bq771610

(1)

4.250

0.250

CMOS Active High

bq771610DPJR

bq771610DPJT

bq771611

(1)

4.350

0.300

CMOS Active High

bq771611DPJR

bq771611DPJT

bq771612

(1)

3.900

0.300

CMOS Active High

bq771612DPJR

bq771612DPJT

bq771613

(1)

4.200

0.050

NCH Active Low

bq771613DPJR

bq771613DPJT

bq771614

(1)

4.225

0.250

NCH Active Low

bq771614DPJR

bq771614DPJT

bq771615

(1)

4.250

0.050

NCH Active Low

bq771615DPJR

bq771615DPJT

CMOS Active High or

bq7716xy

(2)

3.850–4.650

0–0.300

NCH Active Low, Open

bq7716xyTBD

bq7716xyTBD

Drain

(1)

Product Preview only.

(2)

Future Option, contact TI.

THERMAL INFORMATION

bq7716xy

UNITS

8 PINS

Junction-to-ambient thermal resistance

56.6

Junction-to-case(top) thermal resistance

56.4

Junction-to-board thermal resistance

30.6

°C/W

Junction-to-top characterization parameter

1.0

Junction-to-board characterization parameter

37.8

Junction-to-case(bottom) thermal resistance

11.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Links: bq771600 bq771601 bq771602 bq771604