TLV70012A-Q1, TLV70025-Q1, TLV70028-Q1

TLV70030-Q1, TLV70032-Q1, TLV70033-Q1

SLVSA61F – FEBRUARY 2010 – REVISED AUGUST 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

(1)

Input voltage range

–0.3 V to 6 V

Enable voltage range

–0.3 V to 6 V

Output voltage range

–0.3 V to 6 V

Maximum output current

Internally limited

Output short-circuit duration

Indefinite

Operating ambient temperature range

–40°C to 125°C

Storage temperature range

–55°C to 150°C

Human body model (HBM) H2

2 kV

Electrostatic discharge rating

Charged device model (CDM) C4B

750 V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

THERMAL INFORMATION

TLV700xx-Q1

TLV700xx-Q1

UNIT

DCK (5 PINS)

DDC (5 PINS)

Junction-to-ambient thermal resistance

307.6

262.8

Junction-to-case (top) thermal resistance

79.1

68.2

Junction-to-board thermal resistance

93.7

81.6

°C/W

Junction-to-top characterization parameter

1.3

1.1

Junction-to-board characterization parameter

92.8

80.9

Junction-to-case (bottom) thermal resistance

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Links: TLV70012A-Q1 TLV70025-Q1 TLV70028-Q1 TLV70030-Q1 TLV70032-Q1 TLV70033-Q1