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A3983SLPTR Datasheet(PDF) 7 Page - Allegro MicroSystems |
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A3983SLPTR Datasheet(HTML) 7 Page - Allegro MicroSystems |
7 / 13 page DMOS Microstepping Driver with Translator A3983 7 Allegro MicroSystems, LLC 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Application Layout Layout . The printed circuit board should use a heavy ground- plane. For optimum electrical and thermal performance, the A3983 must be soldered directly onto the board. On the under- side of the A3983 package is an exposed pad, which provides a path for enhanced thermal dissipation. The thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer heat to other layers of the PCB. In order to minimize the effects of ground bounce and offset issues, it is important to have a low impedance single-point ground, known as a star ground, located very close to the device. By making the connection between the pad and the ground plane directly under the A3983, that area becomes an ideal location for a star ground point. A low impedance ground will prevent ground bounce during high current operation and ensure that the supply voltage remains stable at the input terminal. The star ground can be created using the exposed thermal pad under the device, to serve both as a low impedance ground point and thermal path. The two input capacitors should be placed in parallel, and as close to the device supply pins as possible. The ceramic capaci- tor (CIN1) should be closer to the pins than the bulk capacitor (CIN2). This is necessary because the ceramic capacitor will be responsible for delivering the high frequency current components. The sense resistors, RSx , should have a very low impedance path to ground, because they must carry a large current while supporting very accurate voltage measurements by the current sense comparators. Long ground traces will cause additional voltage drops, adversely affecting the ability of the comparators to accurately measure the current in the windings. The SENSEx pins have very short traces to the RSx resistors and very thick, low impedance traces directly to the star ground underneath the device. If possible, there should be no other components on the sense circuits. VDD VBB C2 ROSC PAD A3983 C5 C6 C3 C4 R4 R5 C1 OUT2B OUT1B OUT2A OUT1A VBB2 VBB1 DIR SENSE2 SENSE1 CP1 GND ENABLE GND CP2 VCP VREG ROSC VDD MS1 MS2 STEP REF RESET SLEEP GND GND GND GND GND GND GND R4 U1 OUT2B GND R5 OUT2A OUT1A OUT1B C3 C4 C5 ROSC C2 C6 C1 VBB VDD CAPACITANCE BULK PCB Thermal Vias Trace (2 oz.) Signal (1 oz.) Ground (1 oz.) Thermal (2 oz.) Solder A3983 |
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