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TPS22963C Datasheet(PDF) 4 Page - Texas Instruments |
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TPS22963C Datasheet(HTML) 4 Page - Texas Instruments |
4 / 23 page TPS22963 TPS22964 SLVSBS6 – JUNE 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VALUE UNIT VIN Input voltage range –0.3 to 6 V VOUT Output voltage range –0.3 to 6 V VON ON pin voltage range –0.3 to 6 V IMAX Maximum continuous switch current 3 A IPLS Maximum pulsed switch current, 100 µs pulse, 2% duty cycle, TA = –40°C to 85°C 4 A TA Operating free air temperature range –40 to 85 °C TJ Maximum junction temperature 125 °C TSTG Storage temperature range –65 to 150 °C TLEAD Maximum lead temperature (10s soldering time) 300 °C Human-Body Model (HBM) 2000 Electrostatic discharge ESD V protection Charged Device Model (CDM) 500 THERMAL INFORMATION TPS22963/TPS22964 THERMAL METRIC(1) YZP UNITS 6 PINS θJA Junction-to-ambient thermal resistance(2) 132.0 θJCtop Junction-to-case (top) thermal resistance(3) 1.4 θJB Junction-to-board thermal resistance(4) 22.8 °C/W ψJT Junction-to-top characterization parameter(5) 5.7 ψJB Junction-to-board characterization parameter(6) 22.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VIN Input voltage range 1 5.5 V VOUT Output voltage range 0 5.5 V VIN = 2.5V to 5.5V 1.3 5.5 VIH, ON High-level ON voltage V VIN = 1V to 2.49V 1.1 5.5 VIN = 2.5V to 5.5V 0 0.6 VIL, ON Low-level ON voltage V VIN = 1V to 2.49V 0 0.4 CIN Input capacitor 1(1) µF (1) Refer to the application section 4 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS22963 TPS22964 |
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