TPS22963

TPS22964

SLVSBS6 – JUNE 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

Input voltage range

–0.3 to 6

V

Output voltage range

–0.3 to 6

V

ON pin voltage range

–0.3 to 6

V

Maximum continuous switch current

3

A

4

A

Operating free air temperature range

–40 to 85

°C

Maximum junction temperature

125

°C

Storage temperature range

–65 to 150

°C

Maximum lead temperature (10s soldering time)

300

°C

Human-Body Model (HBM)

2000

Electrostatic discharge

ESD

V

protection

Charged Device Model (CDM)

500

THERMAL INFORMATION

TPS22963/TPS22964

YZP

UNITS

6 PINS

132.0

1.4

22.8

°C/W

5.7

22.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

Input voltage range

1

5.5

V

Output voltage range

0

5.5

V

1.3

5.5

High-level ON voltage

V

1.1

5.5

0

0.6

Low-level ON voltage

V

0

0.4

Input capacitor

µF

(1)

Refer to the application section

4

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